| PART |
Description |
Maker |
| C3225X7S2A335KT |
SPECIFICATION FOR TDK MULTILAYER CERAMIC CHIP CAPACITORS
|
TDK Electronics
|
| C5750X7S2A106MT |
SPECIFICATION FOR TDK MULTILAYER CERAMIC CHIP CAPACITORS
|
TDK Electronics
|
| C2012X7S2A105KT |
SPECIFICATION FOR TDK MULTILAYER CERAMIC CHIP CAPACITORS
|
TDK Electronics
|
| C1005X7S2A103KT |
SPECIFICATION FOR TDK MULTILAYER CERAMIC CHIP CAPACITORS
|
TDK Electronics
|
| C1005X5R0J475K C3225X7S1H106M |
TDK MLCC Capacitance Offering
|
TDK Electronics
|
| GLF2012T220K GLF251812T220M GLC2518T101K GLF2518T1 |
GLF,GLC Series
TDK’s New Winding Type Chip Inductor
|
TDK Electronics
|
| 55PC6021 |
This specification sheet forms a part of the latest issue of Raychem Specification 55PC.
|
TE Connectivity Ltd
|
| 55PC0114 |
This specification sheet forms a part of the latest issue of Raychem Specification 55PC.
|
Tyco Electronics
|
| 55PC6362 |
This specification sheet forms a part of the latest issue of Raychem Specification 55PC.
|
TE Connectivity Ltd
|
| CMLT6427E |
ENHANCED SPECIFICATION SURFACE MOUNT, PICOmini SILICON NPN DARLINGTON TRANSISTOR
From old datasheet system
an Enhanced Specification, PICOmini™, NPN Silicon
|
CENTRAL[Central Semiconductor Corp]
Central Semiconductor Corporation
|
| SPM0204LE5H-QB |
Halogen Free Enhanced RF Protected Zero Height Mini隆卤 SiSonic垄芒 Microphone Specification
Halogen Free Enhanced RF Protected Zero Height Mini SiSonic Microphone Specification
|
Knowles Electronics
|
| MPC7451RXSXPND MPC7451RXSXPNS |
MPC7451 Part Number Specification for the XPC7451RXnnnSx Series
Part Number Specification for the XPC7451RXnnnSx Series
|
Motorola
|
